| Refractive Index |
1.48 |
| Tensile shear per ASTM D1002 |
7000 psi |
| Gap filling |
+/ 250 in |
| Thermal range |
45 to 300¡ÆF
|
| Dielectric strength |
700V/ml |
| Elongation at 79°F |
20% |
| Color |
Clear |
| Specific gravity |
1.08 |
| Flash point |
over 200°F |
| Viscosity |
5000 cps |
| Outgassing/degassing |
Above 375°F |
| Hardness |
85D |
|
(1) Apply adhesive to substrate.
(2) Expose to UV light in the 320400 nanometer range. Use of a light at least as powerful as the ElectroLite BondWand (10 mW/cm²) is recommended. Speed of cure depends directly on the intensity of light, amount of adhesive used, and the geometry of the application.
Cures of less than 5 seconds are achieved using the ElectroLite ELC600,ELC700 high intensity spot curing systems or the ELC4001 flood system.
(3) IMPORTANT: Because ELC 4481 only cures upon exposure to UV light, it is important that the bond area be fully exposed to the light source. Care must be taken to eliminate any areas of shadow which might inhibit the curing process.
(4) Certain lighting conditions may cause ELC 4481 to become a light yellow, the properties of the adhesive, however, are not affected. |
